US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Integrated circuit device having active region coupled to conductive patterns on opposite sides of substrate" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,999, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Integrated circuit device having active region coupled to conductive patterns on opposite sides of substrate" was invented by Chung-Hui Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) device includes a substrate, active regions including a first active region, gate regions over the active regions, first and second conductive patterns, and a first through via structure. The active regions are over a first side of the substrate. The first conductive pattern is over and electrically coupled to the f...