US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Fabricating method of semiconductor die with tapered sidewall in package" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,050, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Fabricating method of semiconductor die with tapered sidewall in package" was invented by Chin-Hua Wang (New Taipei City, Taiwan), Shin-Puu Jeng (Hsinchu, Taiwan), Po-Yao Lin (Zhudong Township, Hsinchu County, Taiwan), Po-Chen Lai (Hsinchu County, Taiwan), Shu-Shen Yeh (Taoyuan City, Taiwan), Ming-Chih Yew (Hsinchu City, Taiwan) and Yu-Sheng Lin (Zhubei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor w...