US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Substrate contact in wafer backside" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,825, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Substrate contact in wafer backside" was invented by Hao-Lin Yang (Kaohsiung, Taiwan), Fu-Sheng Kuo (Tainan, Taiwan), Ching-Chun Wang (Tainan, Taiwan), Hsiao-Hui Tseng (Tainan, Taiwan), Tzu-Jui Wang (Fengshan, Taiwan), Chen-Jong Wang (Hsin-Chu, Taiwan) and Dun-Nian Yaung (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated chip including includes a substrate having a first side and a second side opposite the first side. The integrated chip further includes a first photodetector positioned in a first pixel region within the ...