US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 7 for "Semiconductor structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,011, issued on April 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and method for forming the same" was invented by Yu-Hung Lin (Taichung City, Taiwan), Wei-Ming Wang (Taichung City, Taiwan), Su-Chun Yang (Hsinchu County, Taiwan), Jih-Churng Twu (Hsinchu County, Taiwan), Shih-Peng Tai (Xinpu Township, Hsinchu County, Taiwan) and Kuo-Chung Yee (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor structure is provided, and includes trimming a first substrate to form a recess on a sidewall of the first substrate. A conductive structure i...