US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Package structure and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,029, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and method of forming the same" was invented by Chia-Han Hsieh (Miaoli County, Taiwan), Yu-Jin Hu (Taoyuan City, Taiwan), Hua-Wei Tseng (New Taipei City, Taiwan), An-Jhih Su (Taoyuan City, Taiwan) and Der-Chyang Yeh (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a package structure and a method of forming the same. The method includes: forming an interconnect structure on a substrate; performing a laser grooving process to form a first opening in the interconnect structure and form a debris layer on...