US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 7 for "Dual micro-electro mechanical system and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,167, issued on April 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Dual micro-electro mechanical system and manufacturing method thereof" was invented by Yang-Che Chen (Hsinchu City, Taiwan), Victor Chiang Liang (Hsinchu City, Taiwan), Chen-Hua Lin (Douliu City, Taiwan), Chwen-Ming Liu (Hsinchu, Taiwan), Huang-Wen Tseng (Zhubei City, Taiwan) and Yi-Chuan Teng (Zhubei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEM...