US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Contact interface engineering for reducing contact resistance" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,766, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Contact interface engineering for reducing contact resistance" was invented by Mrunal A Khaderbad (Hsinchu, Taiwan), Keng-Chu Lin (Ping-Tung, Taiwan) and Sung-Li Wang (Zhubei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A structure includes a transistor including a first source/drain region, a source/drain contact plug over and electrically coupling to the first source/drain region, and a via over and contacting the source/drain contact plug. The via has a bottom portion having a first length, and an upper portion having a second le...