US Patent Issued to Taiwan Semiconductor Manufacturing on April 21 for "Interposer substrate, package structure and manufacturing method of package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,835, issued on April 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Interposer substrate, package structure and manufacturing method of package structure" was invented by Chia-Yu Ling (Hsinchu City, Taiwan), Hsin-Yu Lai (Hsinchu, Taiwan), Katherine H Chiang (New Taipei City, Taiwan) and Chung-Te Lin (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are an interposer substrate, a package structure and a manufacturing method of a package structure. In one embodiment, the interposer substrate includes a substrate, a bridge device in the substrate, a memory in the substrate and beside the...