US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 21 for "Integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,873, issued on April 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Integrated circuit package and method" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Chi-Hui Lai (Taichung City, Taiwan), Tin-Hao Kuo (Hsinchu, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan) and Chung-Shi Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment includes a first package component including a first integrated circuit die and a first encapsulant at least partially surrounding the first integrated circuit die. The device also includes a redistribution structure on the first encapsulant and coupled to the first inte...