US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 14 for "Semiconductor structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,600,618, issued on April 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and method of manufacturing the same" was invented by Jheng-Hong Jiang (Hsinchu, Taiwan), Shing-Huang Wu (Hsinchu City, Taiwan) and Chia-Wei Liu (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure is provided. The semiconductor structure includes a substrate; a fixed structure, disposed on the substrate; a floating structure, connected to the fixed structure and separated from the substrate, wherein a first surface of the floating structure facing the substrate includes a p...