US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 14 for "Semiconductor image-sensing structure and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,549, issued on April 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor image-sensing structure and method for manufacturing the same" was invented by Ming-Hsien Yang (Taichung City, Taiwan), Chun-Liang Lu (Tainan City, Taiwan), Chun-Hao Chou (Tainan City, Taiwan) and Kuo-Cheng Lee (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor image sensing structure includes a substrate, an isolation structure, an anti-reflection structure, at least one optical element and a transistor. The substrate has at least one photodiode region. The isolation structure is disposed in th...