US Patent Issued to Taiwan Semiconductor Manufacturing on April 14 for "Semiconductor device with sensor and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,709, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device with sensor and manufacturing method thereof" was invented by Wei Lee (Hsinchu City, Taiwan), Chung-Liang Cheng (Changhua County, Taiwan), Pei-Wen Liu (Hsinchu City, Taiwan), Ke-Wei Su (Hsinchu County, Taiwan) and Kuan-Lun Cheng (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate, an interconnect, and a sensor. The substrate includes devices therein and has a front side and a rear side opposite to the front side. The interconnect is disposed on the front side and elect...