US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 14 for "Layout design method and structure with enhanced process window" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,742, issued on April 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Layout design method and structure with enhanced process window" was invented by Jui-Tse Tsai (New Taipei, Taiwan) and Szu-Ling Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a method that includes receiving a circuit layout that includes circuit features and a mark pattern to be formed on a same material layer over an integrated circuit (IC) substrate, the circuit features being longitudinally oriented along a first direction and being distanced from each other along a second direction th...