US Patent Issued to Taiwan Semiconductor Manufacturing on April 14 for "Integrated passive device dies and methods of forming and placement of the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,765, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated passive device dies and methods of forming and placement of the same" was invented by Hsien-Wei Chen (Hsinchu, Taiwan), Chun Huan Wei (Hsinchu, Taiwan), Meng-Liang Lin (Hsinchu, Taiwan) and Shin-Puu Jeng (Po-Shan Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment semiconductor device includes an interposer, a semiconductor die electrically connected to the interposer, an integrated passive device die electrically connected to the interposer, the integrated passive device die including two or more seal rings, ...