US Patent Issued to Taiwan Semiconductor Manufacturing on April 14 for "Integrated circuit packages and methods" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,734, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit packages and methods" was invented by Yi-Che Chiang (Hsinchu, Taiwan), Yuan Sheng Chiu (Miaoli, Taiwan), Hong-Yu Guo (Hsinchu, Taiwan), Hsin-Yu Pan (Taipei, Taiwan) and Tsung-Shu Lin (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit package with a perforated stiffener ring and the method of forming the same are provided. The integrated circuit package may comprise an integrated circuit package component having an integrated circuit die on a substrate, an underfill between the integrated c...