ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,757, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and NATIONAL YANG MING CHIAO TUNG UNIVERSITY (Hsinchu City, Taiwan).

"Manufacturing method of integrated circuit structure" was invented by Hsin-Cheng Lin (Taipei City, Taiwan), Yi-Chun Liu (Taichung City, Taiwan), Kung-Ying Chiu (Taoyuan City, Taiwan) and Chee-Wee Liu (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit structure includes a substrate, a bottom nanostructure transistor, and a top nanostructure transistor. The bottom nanostructure transistor is over the substrate and includes a first channel lay...