US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING, NATIONAL TAIWAN UNIVERSITY on March 17 for "Graphene all around interconnect and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,676, issued on March 17, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and NATIONAL TAIWAN UNIVERSITY (Taipei, Taiwan).

"Graphene all around interconnect and manufacturing method thereof" was invented by Chi-Yuan Kuo (New Taipei, Taiwan), I-Chih Ni (New Taipei, Taiwan), Fang-Yu Fu (New Taipei, Taiwan) and Chih-I Wu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes loading a wafer having a catalytic metal thereon into a processing chamber, introducing a hydrocarbon precursor into the processing chamber, pyrolyzing the hydrocarbon precursor; conducting the pyrolyzed hydrocarbon precur...