US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING, NATIONAL TAIWAN UNIVERSITY on Feb. 17 for "Package structure and method for fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,689, issued on Feb. 17, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and NATIONAL TAIWAN UNIVERSITY (Taipei, Taiwan).

"Package structure and method for fabricating the same" was invented by Tzu-Hsuan Chang (Taipei, Taiwan), Rong-Teng Lin (New Taipei, Taiwan), Bi-Xian Wu (New Taipei, Taiwan), Teng-Chin Hsu (New Taipei, Taiwan), Yun-Hong Yang (Kaohsiung, Taiwan), Chien-Liang Chen (New Taipei, Taiwan), Jam-Wem Lee (Hsinchu, Taiwan), Kuo-Ji Chen (Hsinchu County, Taiwan) and Wun-Jie Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating a package structure is provided. The method ...