US Patent Issued to TAIWAN MICROLOOPS on June 30 for "Heat dissipation structure combining vapor chamber with heat pipe and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,669,294, issued on June 30, was assigned to TAIWAN MICROLOOPS CORP. (New Taipei City, Taiwan).

"Heat dissipation structure combining vapor chamber with heat pipe and manufacturing method thereof" was invented by Chun-Hung Lin (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation structure includes a vapor chamber (1), a heat pipe (2) and a working fluid. The vapor chamber (1) includes an upper shell (11), a lower shell (11) correspondingly sealed with the upper shell (11) and a first wick structure disposed on an inner surface of the upper shell (11). A chamber (S) is defined between the upper shell (11) and the lowe...