US Patent Issued to Taiwan Advanced Systems on June 23 for "Glass metallization process for through glass vias with high aspect ratio" (Taiwanese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,662,417, issued on June 23, was assigned to Taiwan Advanced Systems Corp. (Zhubei City, Taiwan).

"Glass metallization process for through glass vias with high aspect ratio" was invented by Chun Hsiung Hung (Zhubei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A glass metallization process for through glass vias with a high aspect ratio includes a single-sided coating step, a bonding step, a drilling step, a pre-lubricating step and a metallization step; or a drilling step, a single-sided coating step, a bonding step, a pre-lubricating step and a metallization step. Since the walls of the first and second glass substrates, the first and sec...