US Patent Issued to SUZHOU METABRAIN INTELLIGENT TECHNOLOGY on June 2 for "Method for manufacturing stub-free via hole, PCB, electronic device, and storage medium" (Chinese Inventor)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,087, issued on June 2, was assigned to SUZHOU METABRAIN INTELLIGENT TECHNOLOGY Co. LTD. (Jiangsu, China).

"Method for manufacturing stub-free via hole, PCB, electronic device, and storage medium" was invented by Tianqi Yang (Jiangsu, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure relate to the technical field of PCBs, and in particular, relate to a method for manufacturing a stub-free via hole, a PCB, an electronic device, and a non-transitory readable storage medium. The method for manufacturing a stub-free via hole comprises: acquiring a target copper plating length of a to-be-opened via hole; forming a t...