US Patent Issued to Sumitomo Wiring Systems on Nov. 3 for "Molded component" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,377, issued on Nov. 3, was assigned to Sumitomo Wiring Systems Ltd. (Yokkaichi, Japan).

"Molded component" was invented by Lin Wei (Yokkaichi, Japan), Hiroyuki Koyano (Yokkaichi, Japan), Yukitoshi Terasaka (Yokkaichi, Japan), Toshinari Kobayashi (Yokkaichi, Japan) and Megumi Yamao (Yokkaichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A molded component 1 includes an internal component module including a first molded part, solder parts, and a second molded part. Lead wires include a first lead wire and a second lead wire. The first molded part includes a partition having a first face and a second face. The first lead wire has a first expose...