US Patent Issued to Sumitomo Osaka Cement on Aug. 4 for "Electrostatic chuck device with an improved electrostatic chuck plate" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,962, issued on Aug. 4, was assigned to Sumitomo Osaka Cement Co. Ltd. (Tokyo).

"Electrostatic chuck device with an improved electrostatic chuck plate" was invented by Keisuke Maeda (Tokyo), Norito Morishita (Tokyo), Tetsuro Itagaki (Tokyo) and Yoshiki Yoshioka (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electrostatic chuck device including: an electrostatic chuck plate including a dielectric substrate that includes a placement surface on which a sample is mounted and an adsorption electrode that is positioned inside the dielectric substrate; and a base that supports the electrostatic chuck plate. The electrostatic chuck plate includes a ...