ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,734,738, issued on Sept. 15, was assigned to SUMITOMO HEAVY INDUSTRIES LTD. (Tokyo).
"Mold device and injection molding system" was invented by Yuta Nesaki (Chiba, Japan) and Yasuo Suzuki (Chiba, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A mold device includes a fixed mold and a movable mold. Cavity space is formed between the molds when clamped together. The fixed mold includes: a first mold piece that, upon clamping of the molds, contacts the movable mold and forms part of a wall surface of the cavity space; a first cooling part adjusted to lower temperature than the first mold piece; and a first support part movably supporting one of the ...