ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,013, issued on June 30, was assigned to SUMITOMO HEAVY INDUSTRIES LTD. (Tokyo).
"Inflation molding device" was invented by Kazuya Hioki (Yokosuka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An inflation molding device includes a viscosity estimation unit that estimates a viscosity of a bubble discharged in a substantially cylindrical shape from a die, a temperature identification unit that identifies a temperature of the bubble, and a parameter estimation unit that estimates a viscosity parameter of the bubble based on the viscosity of the bubble estimated by the viscosity estimation unit and the temperature of the bubble identified by the...