US Patent Issued to SUMITOMO HEAVY INDUSTRIES on July 14 for "Molding device" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,678,850, issued on July 14, was assigned to SUMITOMO HEAVY INDUSTRIES LTD. (Tokyo).

"Molding device" was invented by Kei Yamauchi (Niihama, Japan), Eiji Kouyama (Niihama, Japan), Hiroyuki Kan (Niihama, Japan) and Norieda Ueno (Niihama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A molding device supplies a fluid and performs expansion molding of a metal material using at least a part of members of an existing press device."

The patent was filed on Jan. 15, 2024, under Application No. 18/412,925.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=...