US Patent Issued to SUMITOMO ELECTRIC PRINTED CIRCUITS on Sept. 8 for "Printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,101, issued on Sept. 8, was assigned to SUMITOMO ELECTRIC PRINTED CIRCUITS INC. (Shiga, Japan).

"Printed wiring board" was invented by Michi Ogata (Shiga, Japan) and Kou Noguchi (Shiga, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The printed wiring board according to an embodiment of the present disclosure comprises: a substrate; a first wiring layer having a first wiring that is disposed directly or indirectly on the substrate; and a second wiring layer having a second wiring that is disposed directly or indirectly on the substrate. The average wire width of the first wiring is 40 micro metre or less, and the average wire width of the seco...