US Patent Issued to SUMITOMO ELECTRIC INDUSTRIES on May 19 for "Printed circuit board and method of manufacturing printed circuit board" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,070, issued on May 19, was assigned to SUMITOMO ELECTRIC INDUSTRIES LTD. (Osaka, Japan).

"Printed circuit board and method of manufacturing printed circuit board" was invented by Hiroshi Ueda (Osaka, Japan), Ippei Tanaka (Osaka, Japan), Takashi Kasuga (Osaka, Japan) and Masamichi Yamamoto (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes: an insulating base film; and a plurality of wiring portions formed on a surface of the base film. The wiring portions include a seed layer directly or indirectly layered on the surface of the base film and a metal layer layered on the seed layer. The base film has a wiring...