US Patent Issued to SUMITOMO ELECTRIC INDUSTRIES, SUMITOMO ELECTRIC PRINTED CIRCUITS on July 21 for "Substrate for printed circuit board and printed circuit board" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,128, issued on July 21, was assigned to SUMITOMO ELECTRIC INDUSTRIES LTD. (Osaka, Japan) and SUMITOMO ELECTRIC PRINTED CIRCUITS INC. (Shiga, Japan).

"Substrate for printed circuit board and printed circuit board" was invented by Yoshio Oka (Osaka, Japan), Kazuhiro Miyata (Osaka, Japan), Motohiko Sugiura (Osaka, Japan), Satoshi Kiya (Shiga, Japan) and Koji Nitta (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate for a printed circuit board includes a base film having a main surface and an electrically conductive layer disposed on the main surface. The base film is made of a fluororesin. The electrically conductive layer is a lay...