US Patent Issued to SUMCO on March 3 for "Method of polishing carrier plate, carrier plate, and method of polishing semiconductor wafer" (Japanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,784, issued on March 3, was assigned to SUMCO Corp. (Tokyo).

"Method of polishing carrier plate, carrier plate, and method of polishing semiconductor wafer" was invented by Shunsuke Mikuriya (Tokyo) and Shinya Takubo (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method capable of efficiently polishing the front and back sides of a carrier plate unused after manufacture, which is used in a double-sided polishing process for semiconductor wafers. The method comprises: sandwiching a carrier plate unused after manufacture and to be polished between an upper surface plate and a lower surface plate in the double-sided polishing appar...