ALEXANDRIA, Va., March 24 -- United States Patent no. 12,583,079, issued on March 24, was assigned to SUMCO Corp. (Tokyo).
"Wafer polishing method and wafer polishing device" was invented by Hiroki Ota (Saga, Japan) and Yuki Nakano (Saga, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer polishing method includes acquiring in-plane thickness distribution information regarding a wafer to be polished or a wafer subjected to the same processing treatment, determining a difference in pressure between a pressure Pc to be applied to the central part of the wafer by introducing a gas into the central region and a pressure Pe to be applied to the outer peripheral part of the wafer by introducing a gas int...