ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,956, issued on April 7, was assigned to SUMCO Corp. (Tokyo).
"Vapor deposition device and vapor deposition method" was invented by Yu Minamide (Tokyo) and Naoyuki Wada (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A vapor deposition device is provided that can suppress an influence on an epitaxial layer which is caused by a position of a lift pin without adjusting an upper and lower heating ratio of a wafer. A reaction chamber is provided with a susceptor on which a carrier is placed, and a carrier lift pin which moves the carrier vertically relative to the susceptor; and the carrier lift pin is installed outside of an outer edge of the wafe...