US Patent Issued to Subtron Technology on June 9 for "Substrate structure" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,756, issued on June 9, was assigned to Subtron Technology Co. Ltd. (Hsinchu County, Taiwan).

"Substrate structure" was invented by Chung Ying Lu (Hsinchu County, Taiwan) and Po-Wen Cheng (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate structure includes a substrate, an insulation filling structure, a chip, a first circuit layer, a second circuit layer and a conductive connector. The substrate has a first surface and a second surface opposite to each other, wherein the substrate is a thermally and electrically conductive material. The insulation filling structure is disposed in the substrate to separate the substrate...