US Patent Issued to STMICROELECTRONICS on Sept. 8 for "Semiconductor package with exposed electrical contacts" (Singaporean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,516, issued on Sept. 8, was assigned to STMICROELECTRONICS PTE LTD (Singapore).

"Semiconductor package with exposed electrical contacts" was invented by Yong Chen (Singapore) and David Gani (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a die and a first lamination layer on the die with openings through the first lamination layer. A redistribution layer is on the first lamination layer and extends through the openings to the die. A plurality of conductive extensions are on the redistribution layer with each stud including a first surface on the redistribution layer, a second surface opposite to the first s...