US Patent Issued to STMicroelectronics on Sept. 8 for "Method of manufacturing semiconductor devices and corresponding semiconductor device" (Italian Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,515, issued on Sept. 8, was assigned to STMicroelectronics S.r.l. (Agrate Brianza, Italy).

"Method of manufacturing semiconductor devices and corresponding semiconductor device" was invented by Riccardo Villa (Milan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor chip or die is arranged on a first surface of a thermally conductive die pad of a substrate such as a leadframe. An encapsulation of insulating material in molded onto the die pad having the semiconductor die arranged on the first surface. At the second surface of the die pad, opposite the first surface, the encapsulation borders on the die pad at a borderline around the die ...