US Patent Issued to STMICROELECTRONICS on May 26 for "Wafer level chip scale packaging with sensor" (Singaporean Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,637,349, issued on May 26, was assigned to STMICROELECTRONICS PTE LTD (Singapore).

"Wafer level chip scale packaging with sensor" was invented by Jing-En Luan (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to a package (e.g., a chip scale package, a wafer level chip scale package (WLCSP), or a package containing a sensor die) with a sensor die on a substrate (e.g., an application-specific integrated circuit die (ASIC), an integrated circuit, or some other type of die having active circuitry) and encased in a molding compound. The sensor die includes a sensing component that is aligned with a centrally located...