US Patent Issued to STMICROELECTRONICS on May 19 for "Sensor package including a sensor die" (Singaporean Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,557, issued on May 19, was assigned to STMICROELECTRONICS PTE LTD (Singapore).

"Sensor package including a sensor die" was invented by Jing-En Luan (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to embodiments of sensor package including a doped resin on respective surfaces and sidewalls of a transparent portion, a sensor die, and a support structure extending from the transparent portion to the sensor die. The support structure suspends the transparent portion over a sensor of the sensor die. The doped resin is doped with an additive material, and the additive material is activated by exposing the doped ...