US Patent Issued to STMicroelectronics on June 23 for "Passivation layer for an integrated circuit device that provides a moisture and proton barrier" (Singaporean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,996, issued on June 23, was assigned to STMicroelectronics Pte Ltd (Singapore).

"Passivation layer for an integrated circuit device that provides a moisture and proton barrier" was invented by Eng Hui Goh (Singapore), Voon Cheng Ngwan (Singapore), Fadhillawati Tahir (Singapore), Ditto Adnan (Singapore), Boon Kiat Tung (Singapore) and Maurizio Gabriele Castorina (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit device includes a metal contact and a passivation layer extending on a sidewall of the metal contact and on first and second surface portions of a top surface of the metal contact. The passivation layer is format ...