US Patent Issued to STMicroelectronics on June 23 for "Optical integrated circuit sensor package using a stacked configuration for the sensor die and the emitter die" (Singaporean Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,665,385, issued on June 23, was assigned to STMicroelectronics PTE LTD (Singapore).

"Optical integrated circuit sensor package using a stacked configuration for the sensor die and the emitter die" was invented by Loic Pierre Louis Renard (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "An optical sensor package includes an emitter die mounted to an upper surface of a package substrate. A sensor die is mounted to the upper surface of the package substrate using a film on die (FOD) adhesive layer that extends over the upper surface and encapsulates the emitter die. The sensor die is positioned in a stacked relationship with respect to the emitter...