US Patent Issued to STMicroelectronics on Feb. 17 for "Method of manufacturing semiconductor devices, corresponding substrate and semiconductor device" (Italian Inventor)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,669, issued on Feb. 17, was assigned to STMicroelectronics S.r.l. (Agrate Brianza, Italy).

"Method of manufacturing semiconductor devices, corresponding substrate and semiconductor device" was invented by Mauro Mazzola (Calvenzano, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor chips to be singulated to individual semiconductor devices are arranged onto respective adjacent areas of a mounting substrate such as a pre-molded leadframe. The mounting substrate is made of a laminar, electrically conductive sculptured structure with molded electrically insulating material. Electrically conductive side formations in the adjacent areas o...