US Patent Issued to STMICROELECTRONICS on April 21 for "Packaged high voltage MOSFET device with connection clip and manufacturing process thereof" (Italian Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,832, issued on April 21, was assigned to STMICROELECTRONICS S.r.l. (Agrate Brianza, Italy).

"Packaged high voltage MOSFET device with connection clip and manufacturing process thereof" was invented by Cristiano Gianluca Stella (San Gregorio di Catania, Italy) and Fabio Russo (Tremestieri Etneo, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "An HV MOSFET device has a body integrating source conductive regions. Projecting gate structures are disposed above the body, laterally offset with respect to the source conductive regions. Source contact regions, of a first metal, are arranged on the body in electric contact with the source conductive reg...