US Patent Issued to STMICROELECTRONICS on April 21 for "Dual interface laminated card and corresponding method for manufacturing a dual interface laminated card" (Italian Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,608,579, issued on April 21, was assigned to STMICROELECTRONICS S.r.l. (Agrate Brianza, Italy).

"Dual interface laminated card and corresponding method for manufacturing a dual interface laminated card" was invented by Antonio Sismundo (Frattamaggiore, Italy), Giuliano Filpi (Caserta, Italy), Antonio Amoroso (Recale, Italy) and Massimo Sena (Marigliano, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "A dual interface laminated card having a stack of layers includes at least a first core plastic layer, a second core plastic layer disposed over the first core plastic layer, an antenna inlay disposed between the second core plastic layer and first co...