US Patent Issued to STMicroelectronics International on Oct. 27 for "Method for manufacturing several integrated circuit packages" (French Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,964, issued on Oct. 27, was assigned to STMicroelectronics International N.V. (Geneva).

"Method for manufacturing several integrated circuit packages" was invented by Laurent Herard (Sainte Foy les Lyon, France), Olivier Zanellato (Chambery, France) and Patrick Laurent (Tullins, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit package includes a support substrate having a mounting face and a lateral wall having an inner face and an outer face. The inner face delimits with the mounting face a cavity. The outer face includes a step extending outwardly of the package. An electronic chip disposed in the cavity and electrically...