US Patent Issued to STMicroelectronics International on April 7 for "Multi-wire bonding test circuit for a converter" (Italian Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,596,159, issued on April 7, was assigned to STMicroelectronics International N.V. (Geneva).

"Multi-wire bonding test circuit for a converter" was invented by Giulio Ricotti (Broni, Italy), Alessandro Sacca' (Milan), Valeria Bottarel (Novara, Italy) and Niccolo' Brambilla (San Donato Milanese, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a power converter including first, second, third and fourth nodes and a wire bonding test circuit. The wire bonding test circuit includes a multiplexer having a first terminal of a first side coupled to the first node and second and third terminals of a second side. The wire bonding test circuit inclu...