US Patent Issued to STMICROELECTRONICS (TOURS) on June 23 for "Electronic chips including J-shaped substrate sidewalls" (French Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,030, issued on June 23, was assigned to STMICROELECTRONICS (TOURS) SAS (Tours, France).

"Electronic chips including J-shaped substrate sidewalls" was invented by Olivier Ory (Tours, France) and Michael De Cruz (Monnaie, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic chip including a semiconductor substrate carrying at least one metal contact extending, within the thickness of the substrate, along at least one flank of the chip."

The patent was filed on May 13, 2022, under Application No. 17/744,397.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2...