US Patent Issued to STMICROELECTRONICS, SHENZHEN STS MICROELECTRONICS on Feb. 17 for "Semiconductor package, method of forming the package and electronic device" (Chinese, Italian Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,647, issued on Feb. 17, was assigned to STMICROELECTRONICS S.r.l. (Agrate Brianza, Italy) and SHENZHEN STS MICROELECTRONICS Co. LTD. (Shenzhen, China).

"Semiconductor package, method of forming the package and electronic device" was invented by Yi Ming Liang (Shenzhen, China), Roberto Tiziani (Nerviano, Italy), Qian Liu (Shenzhen, China) and Feng Ding (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure relate to a semiconductor package, a method of forming the package and an electronic device. For example, the semiconductor package may comprise a first substrate assembly comprising a first surface an...