US Patent Issued to STATS CHIPPAC SEMICONDUCTOR (JIANGYIN) on Aug. 18 for "Chip package with heat dissipation plate and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,930, issued on Aug. 18, was assigned to STATS CHIPPAC SEMICONDUCTOR (JIANGYIN) Co. LTD. (Wuxi City, China).

"Chip package with heat dissipation plate and manufacturing method thereof" was invented by Shuai Yang (Wuxi City, China), Hongde Dai (Wuxi City, China) and Jian Xu (Wuxi City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a chip packaging structure having a heat dissipation plate and a manufacturing method thereof. The packaging structure includes a substrate, at least one chip, the heat dissipation plate, a plastic packaging layer and a metal shielding layer, wherein the heat dissipation plate is bonded ...