US Patent Issued to STATS ChipPAC on Sept. 1 for "Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages" (Singaporean, Chinese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,502, issued on Sept. 1, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages" was invented by Byung Joon Han (Singapore), Il Kwon Shim (Singapore), Yaojian Lin (Jiangyin, China) and Pandi C. Marimuthu (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a standardized carrier. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. The semiconductor wafer is singulated through a first portion of the base semiconductor material to separate the semiconductor di...