US Patent Issued to STATS ChipPAC on Oct. 6 for "Semiconductor devices and methods of making semiconductor devices having embedded photonic bridge die" (Singaporean, Chinese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,798, issued on Oct. 6, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor devices and methods of making semiconductor devices having embedded photonic bridge die" was invented by Kai Chong Chan (Singapore), Linda Pei Ee Chua (Singapore), Yaojian Lin (Jiangyin, China) and Swain Hong Alfred Yeo (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a bridge die including a photonic circuit. An optical epoxy is deposited over the photonic circuit. The bridge die is disposed over a first interconnect structure. An encapsulant is deposited over the bridge die and first interconnect structure. A portion of the...