US Patent Issued to STATS ChipPAC on Nov. 3 for "Semiconductor device and method of forming selective shielding using UV curable ink" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,791, issued on Nov. 3, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming selective shielding using UV curable ink" was invented by JinHee Jung (Incheon, South Korea), ChangOh Kim (Incheon, South Korea) and WooSoon Kim (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate and an electrical component disposed over a surface of the substrate. An antenna can be formed within the substrate. An encapsulant is deposited over the surface of the substrate. An ink material is deposited over the surface of the substrate. The ink material can be a curable epoxy. ...